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BTS 452 R
Smart Power High-Side-Switch
Features * Overload protection * Current limitation * Short circuit protection * Thermal shutdown with restart * Overvoltage protection (including load dump) * Fast demagnetization of inductive loads * Reverse battery protection with external resistor * Open drain diagnostic output for overtemperature and short circuit * Open load detection in OFF - State with external resistor * CMOS compatible input * Loss of GND and loss of Vbb protection * ESD - Protection * Very low standby current Product Summary Overvoltage protection Operating voltage On-state resistance Nominal load current Vbb(AZ) Vbb(on) RON IL(ISO) 62 200 1.8 V m A 6...52 V
P-TO252-5-11
Application
* All types of resistive, inductive and capacitive loads * C compatible power switch for 12 V, 24 V and 42 V DC applications * Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, monolithically integrated in Smart SIPMOS technology. Providing embedded protective functions.
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2004-01-27
BTS 452 R
Block Diagram
+ V bb
Voltage source V Logic
Overvoltage protection
Current limit
Gate protection
OUT
Charge pump Level shifter Rectifier
IN
Limit for unclamped ind. loads
Temperature sensor Load
ESD
ST
Logic
GND
miniPROFET
Signal GND
Load GND
Pin 1 2 3 4 5 TAB
Symbol GND IN Vbb ST OUT Vbb
Function Logic ground Input, activates the power switch in case of logic high signal Positive power supply voltage Diagnostic feedback Output to the load Positive power supply voltage
Pin configuration
Top view
Tab = VBB
1
2
(3)
4
5
GND IN
ST OUT
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2004-01-27
BTS 452 R Maximum Ratings at Tj = 25C, unless otherwise specified Parameter Supply voltage Supply voltage for full short circuit protection Continuous input voltage Load current (Short - circuit current, see page 5) Current through input pin (DC) Operating temperature Storage temperature Power dissipation 1) Inductive load switch-off energy dissipation 1)2) single pulse, (see page 9) Tj =150 C, IL = 1 A Load dump protection 2) VLoadDump3)= VA + VS RI=2, td=400ms, VIN= low or high, VA=13,5V RL = 13.5 RL = 27 Electrostatic discharge voltage (Human Body Model) VESD according to ANSI EOS/ESD - S5.1 - 1993 ESD STM5.1 - 1998 Input pin all other pins Thermal Characteristics junction - case: Thermal resistance @ min. footprint Thermal resistance @ 6 cm 2 cooling area 1) RthJC Rth(JA) Rth(JA) 80 45 3 60 K/W K/W 1 5 73.5 88.5 kV VLoaddump V Symbol Vbb Vbb(SC) VIN IL I IN Tj T stg Ptot EAS Value 52 50 -10 ... +16 self limited 5 -40 ...+150 -55 ... +150 41.6 150 W mJ A mA C Unit V
1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70m thick) copper area for drain connection. PCB is vertical without blown air. (see page 17) 2not subject to production test, specified by design 3V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 . Supply voltages higher than V bb(AZ) require an external current limit for the GND pin, e.g. with a 150 resistor in GND connection. A resistor for the protection of the input is integrated.
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2004-01-27
BTS 452 R Electrical Characteristics Parameter and Conditions at Tj = -40...+150C, Vbb = 12..42V, unless otherwise specified Load Switching Capabilities and Characteristics On-state resistance Tj = 25 C, IL = 1 A, V bb = 9...52 V Tj = 150 C Nominal load current; Device on PCB 1) TC = 85 C, VON = 0.5 V Turn-on time RL = 47 Turn-off time RL = 47 Slew rate on Slew rate off 10 to 30% VOUT , 70 to 40% V OUT, dV/dt on -dV/dt off 0.7 0.9 2 2 V/s RL = 47 , V bb = 13.5 V RL = 47 , V bb = 13.5 V Operating Parameters Operating voltage Undervoltage shutdown of charge pump Tj = -40...+85 C Tj = 150 C Undervoltage restart of charge pump Standby current Tj = -40...+85 C, VIN = low Tj = +150 C 2) , VIN = low Leakage output current (included in Ibb(off)) VIN = low Operating current VIN = high
1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70m thick) copper area for drain connection. PCB is vertical without blown air. (see page 17) 2higher current due temperature sensor
Symbol min. RON I L(ISO) t on t off 1.8 -
Values typ. max.
Unit
m 150 270 2.2 80 80 200 380 180 200 A s
to 90% VOUT to 10% VOUT
Vbb(on) Vbb(under)
6 -
4 0.8
52 4 5.5 5.5
V
Vbb(u cp) Ibb(off)
-
A 15 18 5 2 mA
IL(off) IGND
-
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2004-01-27
BTS 452 R Electrical Characteristics Parameter and Conditions at Tj = -40...+150C, Vbb = 12..42V, unless otherwise specified Protection Functions1) Initial peak short circuit current limit (pin 3 to 5) Tj = -40 C, Vbb = 20 V, tm = 150 s Tj = 25 C Tj = 150 C Tj = -40...+150 C, Vbb > 40 V , ( see page 12 ) Repetitive short circuit current limit Tj = Tjt (see timing diagrams) Vbb < 40V Vbb > 40V Output clamp (inductive load switch off) at VOUT = Vbb - VON(CL), Ibb = 4 mA Overvoltage protection 3) Ibb = 4 mA Thermal overload trip temperature Thermal hysteresis Reverse Battery Reverse battery 4) Drain-source diode voltage (VOUT > Vbb) Tj = 150 C -Vbb -VON 600 52 V mV T jt Tjt 150 10 C K Vbb(AZ) 62 VON(CL) I L(SCr) 59 6 4.5 63 V I L(SCp) 4 6.5 5 2) 9 A Symbol min. Values typ. max. Unit
1Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation . 2not subject to production test, specified by design 3 see also VON(CL) in circuit diagram on page 8 4Requires a 150 resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation! Input current has to be limited (see max. ratings page 3).
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2004-01-27
BTS 452 R Electrical Characteristics Parameter and Conditions at Tj = -40...+150C, Vbb = 12..42V, unless otherwise specified Input and Status feedback Input turn-on threshold voltage Input turn-off threshold voltage Input threshold hysteresis Off state input current VIN = 0.7 V On state input current VIN = 5 V Status output (open drain), Zener limit voltage IST = 1.6 mA Status output (open drain), ST low voltage Tj = -40...+25 C, IST = 1.6 mA Tj = 150 C, IST = 1.6 mA Status invalid after positive input slope 1) Vbb = 20 V Status invalid after negative input slope 1) Input resistance (see page 8) Diagnostic Characteristics Short circuit detection voltage Open load detection voltage 2) Internal output pull down3) ( see page 9 and 14 ) VOUT(OL) = 4 V VOUT(SC) VOUT(OL) RO 65 2.8 3 200 4 750 k V t d(ST-) RI 2 250 3.5 400 5 k t d(ST+) VST(low) 120 0.4 0.6 160 s VST(high) 5.4 6.1 V I IN(on) 3 25 VIN(T+) VIN(T-) V IN(T) I IN(off) 0.8 1 0.4 2.2 25 A V Symbol min. Values typ. max. Unit
1no delay time after overtemperature switch off and short circuit in on-state 2External pull up resistor required for open load detection in off state. 3not subject to production test, specified by design
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BTS 452 R
Input level Normal operation Short circuit to GND Short circuit to Vbb (in off-state) Overload Overtemperature Open Load in off-state L H L H L H L H L H L H
Output level L H L L* H H L H ** L L Z H
Status H H H L L H H H H L H (L 1)) H
*) Out ="L": VOUT < 2.8V typ. **) Out ="H": VOUT > 2.8V typ. Z = high impedance, potential depends on external circuit
1with external resistor between V and OUT bb Page 7
2004-01-27
BTS 452 R Terms
Ibb I IN IN
V Z V ON
Inductive and overvoltage output clamp
+ V bb
Vbb IL PROFET OUT
OUT GND
VON
I ST ST V V bb IN V ST
GND I GND V OUT
R GND
V ON clamped to 59V min.
Input circuit (ESD protection)
R IN I
Overvoltage protection of logic part
ESD- ZD I GND
I
I
The use of ESD zener diodes as voltage clamp at DC conditions is not recommended
Reverse battery protection
5V - V bb
VZ1 =6.1V typ., VZ2 =Vbb(AZ) =62V min., RI=3.5 k typ., RGND=150
R
ST IN ST
R
Logic
I
Status output
OUT
Power Inverse Diode
+5V
GND R
GND
RL
Power GND
RST(ON)
ST
Signal GND
RGND=150, RI=3.5k typ., Temperature protection is not active during inverse current
GND
ESDZD
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2004-01-27
BTS 452 R Open-load detection
OFF-state diagnostic condition: V OUT > 3V typ.; IN=low
R
Vbb disconnect with charged inductive load
EXT
high
IN
Vbb PROFET OUT
OFF
V OUT
ST GND
Logic unit
Open load detection
R
O
Signal GN D
V
bb
GND disconnect Inductive Load switch-off energy dissipation
OUT
E bb E AS
IN
Vbb PROFET
ST GND V bb V IN V ST V GND
IN Vbb PROFET OUT
E Load
=
ST GND ZL
GND disconnect with GND pull up
{
R L
L
EL
ER
IN
Vbb PROFET OUT
Energy stored in load inductance: EL = 1/2 * L * IL2 While demagnetizing load inductance, the energy dissipated in PROFET is EAS = Ebb + EL - ER = VON(CL) * iL(t) dt, with an approximate solution for RL > 0:
ST GND
V bb
VV IN ST
V GND
E AS =
IL * R L IL * L ) * ( V b b + | V O U T ( C L )| ) * ln (1 + | V O U T ( C L )| 2 * RL
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2004-01-27
BTS 452 R Typ. transient thermal impedance ZthJA=f(tp) @ 6cm 2 heatsink area Parameter: D=tp/T
10
2
Typ. transient thermal impedance Z thJA=f(tp) @ min. footprint Parameter: D=tp/T
10 2
K/W
D=0.5 D=0.2
K/W
D=0.5 D=0.2
10 1
10 1
D=0.1 D=0.05 D=0.02
D=0.05 D=0.02 D=0.01
Z thJA
ZthJA
D=0.1
10 0
10 0
D=0.01
10 -1
D=0
10 -1
D=0
10 -2 -7 -6 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10 10 10
s
10
4
10 -2 -7 -6 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10 10 10
tp
s
10
4
tp
Typ. on-state resistance RON = f(Tj) ; Vbb = 13,5V ; Vin = high
300
Typ. on-state resistance RON = f(V bb); IL = 1 A ; Vin = high
400
m
m
150C
300
RON
200
RON
250
150
200
25C -40C
150 100 100 50
50
0 -40 -20
0
20
40
60
80 100 120
C Tj
160
0 0
5
10
15
20
25
30
35
40
V Vbb
50
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2004-01-27
BTS 452 R Typ. turn on time ton = f(Tj ); RL = 47
160
Typ. turn off time toff = f(Tj); RL = 47
160
s
9V
s
120
120
t on
toff
100
13.5V
100
9...42V
80
42V
80
60
60
40
40
20
20
0 -40 -20
0
20
40
60
80 100 120
C Tj
160
0 -40 -20
0
20
40
60
80 100 120
C Tj
160
Typ. slew rate on dV/dton = f(T j) ; RL = 47
2
Typ. slew rate off dV/dtoff = f(Tj); R L = 47
3.5
V/s
1.6
V/s
dV dton
-dV dtoff
42V
1.4 1.2 1 0.8 0.6 0.4 0.2 0 -40 -20
13.5V 9V
2.5
2
1.5
42V
1
0.5
13.5V 9V
0
20
40
60
80 100 120
C Tj
160
0 -40 -20
0
20
40
60
80 100 120
C Tj
160
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2004-01-27
BTS 452 R Typ. standby current Ibb(off) = f(Tj ) ; Vbb = 42V ; VIN = low
10
Typ. leakage current I L(off) = f(Tj) ; Vbb = 42V ; VIN = low
2.5
A
A
I bb(off)
6
I L(off)
0 20 40 60 80 100 120 160
1.5
4
1
2
0.5
0 -40 -20
C Tj
0 -40 -20
0
20
40
60
80 100 120
C Tj
160
Typ. initial peak short circuit current limit IL(SCp) = f(Vbb)
10
Typ. initial short circuit shutdown time toff(SC) = f(Tj,start) ; Vbb = 20V
6
A IL(SCp)
ms
-40C 25C
toff(SC)
30 40 60
4
6
150C
3 4 2
2
1
0 0
10
20
V Vbb
0 -40 -20
0
20
40
60
80 100 120
C Tj
160
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2004-01-27
BTS 452 R Typ. input current IIN(on/off) = f(Tj); Vbb = 13,5V; VIN = low/high VINlow 0,7V; VINhigh = 5V
12 50
Typ. input current I IN = f(VIN); V bb = 13.5V
A
A
-40...25C 150C
IIN
IIN
on off
8
30
6 20
4 10 2
0 -40 -20
0
20
40
60
80 100 120
C Tj
160
0 0
1
2
3
4
5
6
V VIN
8
Typ. input threshold voltage VIN(th) = f(Tj ) ; Vbb = 13,5V
2
Typ. input threshold voltage VIN(th) = f(V bb) ; Tj = 25C
2
V
on
V
on
1.6
1.6
V IN(th)
1.4 1.2 1 0.8 0.6 0.4 0.2 0 -40 -20
V IN(th)
off
1.4 1.2 1 0.8 0.6 0.4 0.2 0 0
off
0
20
40
60
80 100 120
C Tj
160
10
20
30
V Vbb
50
Page 13
2004-01-27
BTS 452 R Maximum allowable load inductance for a single switch off L = f(IL); Tjstart =150C, RL=0
4500
13.5V
Typ. status delay time td(ST+/-) = f(V bb); Tj = 25C
300
mH
3500 3000
s
250
td(ST-)
td(ST+/-)
42V
225 200 175 150 125 100 75 50
td(ST+)
L
2500 2000 1500 1000 500 0 0
25 0.25 0.5 0.75 1 1.25 1.5
A IL
2
0 0
10
20
30
V Vbb
50
Maximum allowable inductive switch-off energy, single pulse EAS = f(IL ); Tjstart = 150C, Vbb = 13,5V
1200
Typ. internal output pull down RO = f(Vbb)
800
mJ
k
600
150C
EAS
RO
800
500
600
400
300 400 200
25C
-40C
200 100
0 0
0.25
0.5
0.75
1
1.25
1.5
A IL
2
0 0
10
20
30
V Vbb
50
Page 14
2004-01-27
BTS 452 R
Timing diagrams
Figure 1a: Vbb turn on:
IN
Figure 2b: Switching a lamp,
IN
Vbb
ST
I
L
V
OUT
ST t
IL
Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition
IN
Figure 2c: Switching an inductive load
IN
V
OUT
90% t on dV/ dton 10% t dV/ dtoff
ST
off
VOUT
IL
t
IL
ST
Page 15
2004-01-27
BTS 452 R
Figure 3a: Turn on into short circuit, shut down by overtemperature, restart by cooling
IN
Figure 3b: Short circuit in on-state shut down by overtemperature, restart by cooling
IN
V
OUT
V OUT
Output short to GND
n o rm a l o p e r a t io n
O u tp u t s h o r t to G N D
IL
I
L( SCp )
I
L( SCr )
I
L
I
L (S C r)
tm ST t t
d(ST+)
ST t
Heating up of the chip may require several milliseconds, depending on external conditions.
Figure 5: Undervoltage restart of charge pump
Figure 4: Overtemperature: Reset if Tj < T jt
IN
Vo n
ST IL
V b b( u c p ) V b ( u n d er ) b
Vbb
TJ
Figure 7: Overvoltage
t
IN
Vb b
V O N (C L )
V
OUT
VO U T ( O L ) ST t
Page 16
2004-01-27
BTS 452 R
Package and ordering code
all dimensions in mm
Package: P-TO252-5-11
6.5 +0.15 -0.05 5.7 MAX.
1)
Ordering code: Q67060-S7405
A B 2.3 +0.05 -0.10 0.5 +0.08 -0.04
(4.24) 1 0.1
(5)
9.98 0.5 6.22 -0.2
0.8 0.15
0.9 +0.20 -0.01 0...0.15
0.15 MAX. per side
0.51 MIN.
5 x 0.6 0.1 1.14
0.5 +0.08 -0.04 0.1 B
4.56
0.25
M
AB
1) Includes mold flashes on each side. All metal surfaces tin plated, except area of cut.
Printed circuit board (FR4, 1.5mm thick, one layer 70m, 6cm2 active heatsink area ) as a reference for max. power dissipation Ptot nominal load current IL(nom) and thermal resistance R thja
Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81669 Munchen (c) Infineon Technologies AG 2001 All Rights Reserved.
Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 17
2004-01-27

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